New Solution Combines Cypress’s HyperFlash™ and HyperRAM™ Memories Based on the High-Bandwidth, Low-Pin-Count HyperBus™ Interface
Cypress Semiconductor Corp. announced the qualification of a small-footprint memory solution that enables instant-on applications. The solution contains Cypress’s 3V 512-Mbit HyperFlash™ and 64-Mbit HyperRAM™ memories in a multi-chip package (MCP) measuring only 8-mm by 6-mm. The Cypress HyperFlash and HyperRAM MCP combines a high-speed NOR flash memory for fast-boot, instant-on capability with a self-refresh DRAM for expanded scratchpad memory in a low-pin-count package for space-constrained and cost-optimized embedded designs. The solution is ideal for a wide range of applications, including automotive clusters and infotainment systems, communication equipment, industrial systems and high-performance consumer products.
The HyperFlash and HyperRAM MCP leverages Cypress’s 12-pin HyperBus™ interface and is housed in a 24-ball ball grid array (BGA) package that shares a common footprint with both discrete HyperFlash and HyperRAM products. This common footprint enables design engineers to implement a single-pad layout that supports either discrete device or the HyperFlash and HyperRAM MCP, allowing changes at any point in the design or product lifecycle without affecting board layout. This flexibility enables differentiated end products based on a single platform design, saving development time and minimizing cost.